Micro-packaging innovations
Micro-packaging innovations
Micro-packaging innovations
Micro-packaging innovations
  • Ultralow dead volume using ceramic volume micro-compensator
  • HPHT electrical feed thru design
  • Wafer level decoupling structure assembly
Electronics innovations 
  • Ultra High resolution
  • High datarate acquisition
  • Power management
  • Data processing (calibrated engineering values records)
  • Dynamic acquisition time
  • Memory management
  • Sensor networking
Firmware innovations 
  • Improved resolution
    • Slow mode uses quick measurement always averaged over 1 sec.
    • Fast mode acquisition 120 Hz
    • Adaptive calibration fits
      • Increased resolution in used-defined environmental conditions
  • Data pre-processing
    • Dynamic acquisition time
      • Follow pressure profiles
      • Identify pressure spike, draw-down and build-up
      • Increase data density for improved interpretation